SIZZIX SIZZIX DIE BRUSH & FOAM PAD FOR WAFER-THIN DIES 660513

Pris:
110 kr
Inkl. 25% Moms
Art.nr:
P1038059
Antal:
Finns i lager
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.